Four-year Effects of Copper-nanoparticles on Durability of Resin/Dentin Interfaces
Objectives: To evaluate the effect of addition of copper nanoparticles at different concentrations into an etchand- rinse adhesive (ER) on the immediate (IM) and 4-year (4y) resin-dentine bond strength (μTBS), nanoleakage (NL) and presence of copper within hybrid layer. Methods: Seven experimental ER adhesives were formulated according to the amount of copper nanoparticles incorporated into the adhesives (0 [control], 0.0075 to 1 wt.%). The adhesives were applied to flat occlusal dentine surfaces after acid etching. After resin build-ups, specimens were longitudinally sectioned to obtain beam-like resin-dentine specimens (0.8 mm2), which were used for evaluation of μTBS, nanoleakage and presence of copper within hybrid layer at the IM and 4y periods. Data were submitted to appropriate statistical analyses (α=0.05). Results: After 4y, significantly higher μTBS values significantly lower nanoleakage values were observed for copper containing adhesives compared to the control group. For presence of copper within hybrid layer, concentrations from 0.06 up to 1 wt.% present copper after 4y. Conclusions: Copper nanoparticles addition up to 1 wt.% prevent the degradation of the ER adhesives interface.
Ñaupari-villasante, Romina
( State University of Ponta Grossa
, Ponta Grossa
, Paraná
, Brazil
)
Gutierrez, Felipe
( Universidad de los Andes
, Santiago
, Región Metropolitana
, Chile
; Universidad Finis Terrae
, Santiago
, Región Metropolitana
, Chile
)
Núñez, Alejandra
( State University of Ponta Grossa
, Ponta Grossa
, Paraná
, Brazil
)
Loguercio, Alessandro
( State University of Ponta Grossa
, Ponta Grossa
, Paraná
, Brazil
)
Reis, Alessandra
( State University of Ponta Grossa
, Ponta Grossa
, Paraná
, Brazil
)