IADR Abstract Archives
Bonding to Enamel Using Alternative Enamel Conditioner/Etchants
Objectives: Phosphoric acid is standardly used to etch enamel prior to the application of dental adhesives. We aimed to investigate the enamel bonding efficacy and durability of three new alternative etchants combined with three representative adhesives.
Methods: The ‘immediate’ and ‘aged’ micro-tensile bond strength (µTBS) of the 3-step etch&rinse adhesive OptiBond FL (‘O-FL’, Kerr), the 2-step self-etch (SE) adhesive Clearfil SE Bond 2 (‘C-SE2,’ Kuraray Noritake) and the universal adhesive Adhese Universal (‘ADU’, Ivoclar Vivadent) were measured when they were bonded to enamel following either a proprietary organic acid-containing Enamel Conditioner (‘EC’, Shofu), a phosphoric acid monomer-containing Multi Etchant (‘ME’, Yamakin: 10-methacryloyloxy tetraethylene glycol dihydrogenphosphate or MTEGP), or a metal salt-based ZON etchant (‘ZON’, Ivoclar Vivadent: ZrO(NO3)2). All alternative etchants were used in replacement of phosphoric acid, the latter (K-etchant, Kuraray Noritake) also being used with Opti-FL and ADU as control, in addition to C-SE2 that as control was also solely used in SE mode. The enamel-etching patterns and de-bonded fracture surfaces were examined by SEM, while the interfaces with enamel were ultra-morphologically characterized by TEM.
Results: No statistically significant difference in immediate and aged µTBS obtained by combining the three alternative etchants with the three adhesives was recorded as compared with the respective controls, except for ME combined with O-FL. Somewhat unexpected, the µTBSs measured for O-FL generally underscored, though not always significantly different, those of the other etchant/adhesive combinations. Upon aging, significant reduction in µTBS was recorded for the ME/C-SE2 and ME/ADU combinations. The percentage of adhesive failures increased with aging. SEM revealed similar etching patterns produced by EC and ZON as by conventional phosphoric acid, for which also numerous micro-resin tags at the adhesive-enamel interface were disclosed.
Conclusions: Durable bonding to enamel was generally obtained for all etchant/adhesive combinations with the exception of the ME/O-FL combination.
Methods: The ‘immediate’ and ‘aged’ micro-tensile bond strength (µTBS) of the 3-step etch&rinse adhesive OptiBond FL (‘O-FL’, Kerr), the 2-step self-etch (SE) adhesive Clearfil SE Bond 2 (‘C-SE2,’ Kuraray Noritake) and the universal adhesive Adhese Universal (‘ADU’, Ivoclar Vivadent) were measured when they were bonded to enamel following either a proprietary organic acid-containing Enamel Conditioner (‘EC’, Shofu), a phosphoric acid monomer-containing Multi Etchant (‘ME’, Yamakin: 10-methacryloyloxy tetraethylene glycol dihydrogenphosphate or MTEGP), or a metal salt-based ZON etchant (‘ZON’, Ivoclar Vivadent: ZrO(NO3)2). All alternative etchants were used in replacement of phosphoric acid, the latter (K-etchant, Kuraray Noritake) also being used with Opti-FL and ADU as control, in addition to C-SE2 that as control was also solely used in SE mode. The enamel-etching patterns and de-bonded fracture surfaces were examined by SEM, while the interfaces with enamel were ultra-morphologically characterized by TEM.
Results: No statistically significant difference in immediate and aged µTBS obtained by combining the three alternative etchants with the three adhesives was recorded as compared with the respective controls, except for ME combined with O-FL. Somewhat unexpected, the µTBSs measured for O-FL generally underscored, though not always significantly different, those of the other etchant/adhesive combinations. Upon aging, significant reduction in µTBS was recorded for the ME/C-SE2 and ME/ADU combinations. The percentage of adhesive failures increased with aging. SEM revealed similar etching patterns produced by EC and ZON as by conventional phosphoric acid, for which also numerous micro-resin tags at the adhesive-enamel interface were disclosed.
Conclusions: Durable bonding to enamel was generally obtained for all etchant/adhesive combinations with the exception of the ME/O-FL combination.
IMAGES
3223183_File000001.jpg
3223183_File000001.jpg