IADR Abstract Archives
Physical Properties of Bulk Fill Flowable
Objectives: To compare the polymerization stress, depth of cure, radiopacity and wear properties of Dentsply Bulk Fill Flowable with some other commercially available flowable materials.
Methods: Dentsply Bulk Fill Flowable, SureFil SDR Flow (SDR) and Esthet-X Flow from Dentsply were used. Polymerization Stress (N=4) was measured using a tensometer with 60 seconds light cure and recorded at 30 minutes post cure. Depth of cure (N=3) and radiopacity (N=3) were measured according to ISO 4049. Wear (N=25) data were recorded as volume loss ratio to SureFil SDR Flow after 400,000 cycles on localized Leinfelder wear testers.
Results: Results of polymerization stress, depth of cure, radiopacity and wear are summarized in the following table. Letters indicate significant differences by ANOVA with post Tukey’s test (p < 0.05).
Conclusions: The tested materials vary in polymerization stress, depth of cure, radiopacity and wear. Compared to SureFil SDR Flow, Dentsply Bulk Fill Flowable materials exhibits higher wear resistance and higher radiopacity while maintaining high depth cure and low polymerization stress.
Methods: Dentsply Bulk Fill Flowable, SureFil SDR Flow (SDR) and Esthet-X Flow from Dentsply were used. Polymerization Stress (N=4) was measured using a tensometer with 60 seconds light cure and recorded at 30 minutes post cure. Depth of cure (N=3) and radiopacity (N=3) were measured according to ISO 4049. Wear (N=25) data were recorded as volume loss ratio to SureFil SDR Flow after 400,000 cycles on localized Leinfelder wear testers.
Results: Results of polymerization stress, depth of cure, radiopacity and wear are summarized in the following table. Letters indicate significant differences by ANOVA with post Tukey’s test (p < 0.05).
Conclusions: The tested materials vary in polymerization stress, depth of cure, radiopacity and wear. Compared to SureFil SDR Flow, Dentsply Bulk Fill Flowable materials exhibits higher wear resistance and higher radiopacity while maintaining high depth cure and low polymerization stress.