Objectives: To compare the shear bond strength (SBS) of 5 All-in-One (AIO) adhesive systems on enamel and dentin at 24hrs and 10,000cycles.
Methods: Adhesives: iBOND Self-Etch (IBSE, Heraeus Kulzer), Clearfil S3 Bond (S3B, Kuraray), Adper Easy Bond (AEB, 3M ESPE), Optibond solo Plus (OSP, Kerr) and Xeno IV (XIV, Dentsply-Caulk). Adhesives were applied according to manufacturers' instructions and light-activated. 160 human molars were randomly divided into 20 groups (n=8). Flat enamel and dentin surfaces were prepared on SiC paper, grit 120 through 320. Venus Diamond composite, shade A2 (Heraeus Kulzer) was filled in cylindrical plastic molds (Ultradent equipment) and cured for 20s. Light-activation of adhesives and composite was done with a LED curing unit (Translux Power Blue, Heraeus Kulzer). Shear bond strength (shear rate:1mm/min) was determined after 24h water-storage of specimens at 37°C and after additional thermocycling (10k, 5/55°C). Statistical analysis was done by three-way ANOVA, with post-hoc analysis conducted via Tukey's HSD.
Results:
Results after 24h at 37C | Enamel | Dentin | ||||||||
IBSE | AEB | S3B | OAO | XIV | IBSE | AEB | S3B | OAO | XIV | |
Mean Value [Mpa] | 32.8 | 30.6 | 29.4 | 24.6 | 26.5 | 39.3 | 42.9 | 38.3 | 40.2 | 33.3 |
Standard Deviation [Mpa] | 4 | 3.3 | 5 | 5.6 | 5 | 2.8 | 3.8 | 7.6 | 8.3 | 7.9 |
Results after 10,000 Thermocycles | Enamel | Dentin | ||||||||
IBSE | AEB | S3B | OAO | XIV | IBSE | AEB | S3B | OAO | XIV | |
Mean Value [Mpa] | 31.3 | 25.3 | 25.5 | 32.4 | 13.1 | 33.7 | 39.5 | 39.5 | 35.6 | 28.9 |
Standard Deviation [Mpa] | 2.6 | 3.9 | 3.6 | 6 | 4.4 | 5.7 | 3.1 | 5.1 | 6.9 | 13.4 |
Conclusion: The AIO adhesives had significantly higher SBS when applied to dentin than when applied to enamel (p<0.001). Bond values were significantly higher after 24hours at 37°C than after additional thermocycling (p=0.001). The adhesive system was also a statistically significant factor (p<0.001); the post-hoc analysis revealed that XIV exhibited lower SBS than all other systems. Sponsored in part by Heraeus Kulzer