IADR Abstract Archives
Tensile Bond Strength of Chemical-cure Adhesives to Enamel and Dentin
Objectives:
The aim of the present study was to evaluate the tensile bond strengths, TBSs, of chemical-cure adhesives to enamel and dentin.
Methods: Two types of chemical cure (EL, Este Link, and K5, Bondmer Lightless, Tokuyama Dental) and a light-cure adhesive (GB, G-Premio Bond, GC) were tested in this study.
Flat surfaces of bovine enamel and dentin were grinded with SiC paper, grit #600, and ultra-sonicated for 10 min in distilled water. Each adhesive was applied on the surface according the manufacturer’s instructions. Then a cylindrical stainless mold (3.0mm height, 4.0mm diameter) was put on the surface and resin composite was filled (Estelite Universal Flow Medium, Tokuyama Dental). After the specimens were stored in distilled water at 37°C for 24hrs, the specimens were thermal-cycled, alternately 5°C and 60°C for 30 sec, at 0, 1000, 3000 or 5000 cycles. And TBS was measured by universal testing machine (cross head speed at 0.5mm/min).
The data were statistically analyzed by Two-way ANOVA (p<0.05, n=12).
Results: The TBSs to enamel/dentin before thermal stress showed 11.6±4.2/11.5±2.6 MPa for EL, 10.9±1.8/17.7±3.1 MPa for K5, 11.4±3.3/9.6±1.4 MPa for GB. Overall, The TBSs seemed to be decreased by thermal stress. However, the degree of decrease was not corresponded to the number of stress cycle.
Regarding the adhesion to enamel, there were no interactions between the products tested and thermal stress. Though TBS of EL and GB was significantly decreased after thermal stress, K5 was not.
In terms of the adhesion to dentin, there was the interaction between the products tested and thermal stress. The main factor of the decreased TBSs seemed to be thermal stress.
Conclusions: The tensile bond strengths of chemical-cure adhesives were equal to light cured adhesive though the strengths were decreased by thermal stress.
The aim of the present study was to evaluate the tensile bond strengths, TBSs, of chemical-cure adhesives to enamel and dentin.
Methods: Two types of chemical cure (EL, Este Link, and K5, Bondmer Lightless, Tokuyama Dental) and a light-cure adhesive (GB, G-Premio Bond, GC) were tested in this study.
Flat surfaces of bovine enamel and dentin were grinded with SiC paper, grit #600, and ultra-sonicated for 10 min in distilled water. Each adhesive was applied on the surface according the manufacturer’s instructions. Then a cylindrical stainless mold (3.0mm height, 4.0mm diameter) was put on the surface and resin composite was filled (Estelite Universal Flow Medium, Tokuyama Dental). After the specimens were stored in distilled water at 37°C for 24hrs, the specimens were thermal-cycled, alternately 5°C and 60°C for 30 sec, at 0, 1000, 3000 or 5000 cycles. And TBS was measured by universal testing machine (cross head speed at 0.5mm/min).
The data were statistically analyzed by Two-way ANOVA (p<0.05, n=12).
Results: The TBSs to enamel/dentin before thermal stress showed 11.6±4.2/11.5±2.6 MPa for EL, 10.9±1.8/17.7±3.1 MPa for K5, 11.4±3.3/9.6±1.4 MPa for GB. Overall, The TBSs seemed to be decreased by thermal stress. However, the degree of decrease was not corresponded to the number of stress cycle.
Regarding the adhesion to enamel, there were no interactions between the products tested and thermal stress. Though TBS of EL and GB was significantly decreased after thermal stress, K5 was not.
In terms of the adhesion to dentin, there was the interaction between the products tested and thermal stress. The main factor of the decreased TBSs seemed to be thermal stress.
Conclusions: The tensile bond strengths of chemical-cure adhesives were equal to light cured adhesive though the strengths were decreased by thermal stress.