Evaluation of the Effects of Solvent Evaporation Time on the Dentin Adhesion With the Universal Adhesives System

Objectives: Evaluation the microtensile bond strenghs (uTBS) and nanoleakage (NL) of three universal or multi-mode adhesive, applied with increasing solvent evaporation times.
Methods: One-hundred and forty caries-free extracted third molars were divided into 20 groups for bond strength testing according to three factors: (1) Adhesive-All-Bond Universal (ABU, Bisco, inc.), Prime&Bond Elect (PBE, Dentsply), and Scotchbond Universal Adhesive solvent evaporation time – 5s, 15s, and 25s. Two extra groups were prepared with ABU because the respective manufacturer recommends a solvent evaporation time of 10s. After restorations were constructed, specimens were stored in water (37°C/24 h). Resin-dentin beams (0.8mm³) were tested at 0.5 mm/min (mTBS). For NL, forty extracted molars were randomly assigned to each of the 20 groups. Dentin disks were restored, immersed in ammoniacal silver nitrate, sectioned and processed for evaluation under a FESEM in backscattered mode. Data from mTBS were analyzed using two-way ANOVA (adhesive vs. drying time) for each strategy, and Tukey´s test (µ=0.05). NL data were computed with non-parametric tests (kruskal-Wallis and Mann-Whitney tests, (µ=0.05).
Results: Increasing solvent evaporation time from 5s to 25s resulted in statistically higher mean mTBS for all adhesives when used in ER mode. Regarding NL, ER resulted in grater NL than SE for each of the evaporation times regardless of the adhesive used. A solvent evaporation time of 25 s resulted in the lowest NL for SBU-ER.
Conclusions: Residual water and/or solvent may compromise the performance of universal adhesive systems.